Solid-state imaging device, imaging apparatus, and manufacturing method of solid-state imaging device

ABSTRACT

Image plane phase difference pixels that can handle incident light at two or more chief ray angles are realized. A solid-state imaging device includes a pixel, the pixel including a microlens that condenses light from a subject, a photoelectric conversion unit that receives the subject light condensed by the microlens to generate an electrical signal according to an amount of received light, and a light shielding portion provided between the photoelectric conversion unit and the microlens. The light shielding portion includes an edge portion formed across over a light receiving surface of the photoelectric conversion unit, and the edge portion includes a first edge portion and a second edge portion at positions different from each other both in a first direction corresponding to an up and down direction of an output image and a second direction corresponding to a left and right direction of the output image.

TECHNICAL FIELD

The present technique relates to a solid-state imaging device, animaging apparatus, and a manufacturing method of a solid-state imagingdevice.

BACKGROUND ART

In recent years, an imaging apparatus provided with an auto focus (AF)function for automatically adjusting the focus during imaging is widelyused. The AF systems are roughly classified into an active system and apassive system. In the active system, the time of return of a reflectedwave, such as infrared light and ultrasound, applied to an object(subject) and the illumination angle are used to detect the distance. Inthe passive system, an image captured by a lens is used to measure thedistance. There are a contrast detection system and a phase differencedetection system in the passive system.

Examples of the phase difference detection system include: a systemprovided with an image sensor dedicated to phase difference AF inaddition to an image sensor for imaging; and an image plane phasedifference AF system in which phase difference detection pixels areincorporated into an imaging sensor. In either system, the lightentering from the lens is divided into two (pupil division), and thefocus position is detected from the deviation of the images. The formeris provided with the image sensor dedicated to the phase difference AFin addition to the image sensor for imaging, and there is a disadvantagethat the size of the imaging apparatus becomes large. The latter has anadvantage that the size of the imaging apparatus can be small becausethe pixels for phase difference detection (phase difference detectionpixels) are incorporated into the image sensor for imaging.

In the image plane phase difference AF system, an AF operation isperformed based on phase difference signals acquired from the phasedifference detection signals. A plurality of image plane phasedifference pixels are arranged in an angle of view, and the pixels havea pixel structure such that left and right halves or upper and lowerhalves of openings on photodiodes as light receiving devices areshielded. The image plane phase difference pixels are provided in pairs,in which one half of the subject light is shielded in one image planephase difference pixel, and the other half of the subject light isshielded in the other image plane phase difference pixel. One phasedifference signal is created based on different incident anglecharacteristics of the image plane phase difference pixels in pairs (forexample, see PTL 1).

PTL 1 discloses a light shielding portion of the image plane phasedifference pixel formed such that the position of an imaging point of amicrolens and the position of an edge portion on an entrance side of thelight shielding portion are separated according to the change in theimage height. Although the angle of incidence of the subject lightentering the image sensor is gradually deviated from the imaging pointof the microlens outside of the axis of the set lens, the technique ofPTL 1 can be applied to design the position of the end portion on theentrance side of the light shielding portion in line with the angle ofincidence of the subject light from the set lens according to thecoordinates in the chip.

CITATION LIST Patent Literature [PTL 1]

JP 2012-182332A

SUMMARY Technical Problems

However, in a lens interchangeable imaging apparatus, the chief rayangle is different depending on the installed lens, and the image planephase difference pixels need to be provided according to the chief rayangle of each lens. Even if there is one lens, the chief ray anglechanges with a change in the zoom position, and the image plane phasedifference pixels need to be provided according to the chief ray angleof each zoom position. Even if a plurality of lenses or zoom positionswith similar properties of the chief ray angle are grouped, and theimage plane phase difference pixels are provided for each group, a largenumber of image plane phase difference pixels need to be provided whenthe angle range of the lens line-up or the angle range of the zoomposition is wide. The image plane phase difference pixels are handled asdefective pixels that cannot be used as constituent elements of thecaptured image, and an increase in the image plane phase differencepixels degrades the image quality of the captured image.

The present technique has been made in view of the problems, and anobject of the present technique is to realize a solid-state imagingdevice including image plane phase difference pixels that can handleincident light at two or more chief ray angles, a solid-state imagingapparatus including the solid-state imaging device, and a manufacturingmethod of the solid-state imaging device.

Solution to Problems

An aspect of the present technique provides a solid-state imaging deviceincluding a pixel, the pixel including a microlens that condenses lightfrom a subject, a photoelectric conversion unit that receives thesubject light condensed by the microlens to generate an electricalsignal according to an amount of received light, and a light shieldingportion provided between the photoelectric conversion unit and themicrolens. The light shielding portion includes an edge portion formedacross over a light receiving surface of the photoelectric conversionunit, and the edge portion includes a first edge portion and a secondedge portion at positions different from each other both in a firstdirection corresponding to an up and down direction of an output imageand a second direction corresponding to a left and right direction ofthe output image.

Another aspect of the present technique provides a solid-state imagingdevice including a pixel, the pixel including a microlens that condenseslight from a subject, a photoelectric conversion unit that receives thesubject light condensed by the microlens to generate an electricalsignal according to an amount of received light, and a light shieldingportion provided between the light receiving element and the microlens.The light shielding portion includes an edge portion formed across overa light receiving surface of the photoelectric conversion unit, and theedge portion includes a stepped portion on a midway of the edge portion.

A further aspect of the present technique provides a solid-state imagingdevice including a pixel, the pixel including a microlens that condenseslight from a subject, a photoelectric conversion unit that receives thesubject light condensed by the microlens to generate an electricalsignal according to an amount of received light, and a light shieldingportion provided between the light receiving element and the microlens.The pixel is formed at a corner section of the solid-state imagingdevice, the light shielding portion includes an edge portion formedacross over a light receiving surface of the photoelectric conversionunit, and the edge portion is formed across over the light receivingsurface of the photoelectric conversion unit in a third directiondifferent from both a first direction corresponding to an up and downdirection of an output image and a second direction corresponding to aleft and right direction of the output image.

A further aspect of the present technique provides an imaging apparatusincluding a solid-state imaging device and a focus determination unit.The solid-state imaging device includes a pixel, the pixel including amicrolens that condenses light from a subject, a photoelectricconversion unit that receives the subject light condensed by themicrolens to generate an electrical signal according to an amount ofreceived light, and a light shielding portion provided between thephotoelectric conversion unit and the microlens. The light shieldingportion includes an edge portion formed across over a light receivingsurface of the photoelectric conversion unit, and the edge portionincludes a first edge portion and a second edge portion at positionsdifferent from each other both in a first direction corresponding to anup and down direction of an output image and a second directioncorresponding to a left and right direction of the output image. Thefocus determination unit performs focus determination through phasedifference detection based on the signal generated by the pixel.

A further aspect of the present technique provides an imaging apparatusincluding a solid-state imaging device and a focus determination unit.The solid-state imaging device includes a pixel, the pixel including amicrolens that condenses light from a subject, a photoelectricconversion unit that receives the subject light condensed by themicrolens to generate an electrical signal according to an amount ofreceived light, and a light shielding portion provided between the lightreceiving element and the microlens. The light shielding portionincludes an edge portion formed across over a light receiving surface ofthe photoelectric conversion unit, and the edge portion includes astepped portion on a midway of the edge portion. The focus determinationunit performs focus determination through phase difference detectionbased on the signal generated by the pixel.

A further aspect of the present technique provides an imaging apparatusincluding a solid-state imaging device and a focus determination unit.The solid-state imaging device includes a pixel, the pixel including amicrolens that condenses light from a subject, a photoelectricconversion unit that receives the subject light condensed by themicrolens to generate an electrical signal according to an amount ofreceived light, and a light shielding portion provided between the lightreceiving element and the microlens. The pixel is formed at a cornersection of the solid-state imaging device, the light shielding portionincludes an edge portion formed across over a light receiving surface ofthe photoelectric conversion unit, and the edge portion is formed acrossover the light receiving surface of the photoelectric conversion unit ina third direction different from both a first direction corresponding toan up and down direction of an output image and a second directioncorresponding to a left and right direction of the output image. Thefocus determination unit performs focus determination through phasedifference detection based on the signal generated by the pixel.

A further aspect of the present technique provides a manufacturingmethod of a solid-state imaging device, the manufacturing methodincluding a step of forming a pixel, the pixel including a microlensthat condenses light from a subject, a photoelectric conversion unitthat receives the subject light condensed by the microlens to generatean electrical signal according to an amount of received light, and alight shielding portion provided between the photoelectric conversionunit and the microlens. The light shielding portion includes an edgeportion formed across over a light receiving surface of thephotoelectric conversion unit, and the edge portion includes a firstedge portion and a second edge portion at positions different from eachother both in a first direction corresponding to an up and downdirection of an output image and a second direction corresponding to aleft and right direction of the output image.

A further aspect of the present technique provides a manufacturingmethod of a solid-state imaging device, the manufacturing methodincluding a step of forming a pixel, the pixel including a microlensthat condenses light from a subject, a photoelectric conversion unitthat receives the subject light condensed by the microlens to generatean electrical signal according to an amount of received light, and alight shielding portion provided between the light receiving element andthe microlens. The light shielding portion includes an edge portionformed across over a light receiving surface of the photoelectricconversion unit, and the edge portion includes a stepped portion on amidway of the edge portion.

A further aspect of the present technique provides a manufacturingmethod of a solid-state imaging device, the manufacturing methodincluding a step of forming a pixel, the pixel including a microlensthat condenses light from a subject, a photoelectric conversion unitthat receives the subject light condensed by the microlens to generatean electrical signal according to an amount of received light, and alight shielding portion provided between the light receiving element andthe microlens. The pixel is formed at a corner section of thesolid-state imaging device, the light shielding portion includes an edgeportion formed across over a light receiving surface of thephotoelectric conversion unit, and the edge portion is formed acrossover the light receiving surface of the photoelectric conversion unit ina third direction different from both a first direction corresponding toan up and down direction of an output image and a second directioncorresponding to a left and right direction of the output image.

Note that the solid-state imaging device and the solid-state imagingapparatus described above include various other modes. For example, thesolid-state imaging device and the solid-state imaging apparatus can beincorporated into other devices and implemented or can be implementedalong with other methods. The present technique can also be realized asan imaging system including the solid-state imaging device or thesolid-state imaging apparatus. The manufacturing method of thesolid-state imaging device includes various modes. For example, themanufacturing method can be implemented as part of another method, orthe manufacturing method can be realized as a manufacturing apparatus ofthe solid-state imaging device including means corresponding to eachstep or as a solid-state imaging apparatus including the solid-stateimaging device created by the manufacturing method.

Advantageous Effects of Invention

According to the present technique, a solid-state imaging deviceincluding image plane phase difference pixels that can handle incidentlight at two or more chief ray angles, a solid-state imaging apparatusincluding the solid-state imaging device, and a manufacturing method ofthe solid-state imaging device can be realized. Note that theadvantageous effects described in the present specification areillustrative only and are not limited. There may be additionaladvantageous effects.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a diagram describing a structure of a solid-state imagingdevice according to a first embodiment.

FIG. 2 is a diagram describing a first edge portion and a second edgeportion in an edge portion of a light shielding portion.

FIG. 3 is a diagram describing first edge portions and second edgeportions in edge portions of light shielding portions.

FIG. 4 is a diagram describing the first edge portions and the secondedge portions in the edge portions of the light shielding portions.

FIG. 5 is a diagram describing the first edge portions and the secondedge portions in the edge portions of the light shielding portions.

FIG. 6 is a diagram describing the first edge portions and the secondedge portions in the edge portion of the light shielding portions.

FIG. 7 is a diagram describing the first edge portions and the secondedge portions in the edge portions of the light shielding portions.

FIG. 8 is a diagram describing the first edge portions and the secondedge portions in the edge portions of the light shielding portions.

FIG. 9 is a diagram describing the first edge portions and the secondedge portions in the edge portions of the light shielding portions.

FIG. 10 is a diagram describing the first edge portions and the secondedge portions in the edge portions of the light shielding portions.

FIG. 11 is a diagram describing the first edge portions and the secondedge portions in the edge portions of the light shielding portions.

FIG. 12 is a diagram describing positions and arrangement direction ofpixels including the light shielding portions on the solid-state imagingdevice.

FIG. 13 is a block diagram depicting a configuration of a solid-stateimaging apparatus.

FIG. 14 is a cross-sectional diagram of a structure of main parts of aback-side illuminated solid-state imaging device.

FIG. 15 is a diagram describing an example of a functional configurationof an imaging apparatus according to a second embodiment.

FIG. 16 is a schematic diagram depicting an example of pixel arrangementin a solid-state imaging device.

FIG. 17 is a diagram describing received light data obtained from phasedifference detection pixels.

FIG. 18 is a diagram describing imaging positions during focusing in thephase difference detection pixels.

FIG. 19 is a diagram describing imaging positions during focusing in thephase difference detection pixels.

FIG. 20 is a diagram describing influence on received light intensitycaused by installation of a stepped portion.

FIG. 21 is a diagram depicting main parts of a solid-state imagingdevice in each step of a manufacturing method of the solid-state imagingdevice.

FIG. 22 is a diagram depicting main parts of the solid-state imagingdevice in each step of the manufacturing method of the solid-stateimaging device.

FIG. 23 is a diagram depicting main parts of the solid-state imagingdevice in each step of the manufacturing method of the solid-stateimaging device.

FIG. 24 is a diagram depicting main parts of the solid-state imagingdevice in each step of the manufacturing method of the solid-stateimaging device.

FIG. 25 is a diagram depicting main parts of the solid-state imagingdevice in each step of the manufacturing method of the solid-stateimaging device.

FIG. 26 is a diagram depicting main parts of the solid-state imagingdevice in each step of the manufacturing method of the solid-stateimaging device.

DESCRIPTION OF EMBODIMENTS

Hereinafter, the present technique will be described in the followingorder.

-   (A) First Embodiment:-   (B) Second Embodiment:-   (C) Third Embodiment:

(A) First Embodiment

FIG. 1 is a diagram describing a structure of a solid-state imagingdevice 100 according to the present embodiment.

The solid-state imaging device 100 includes a light receiving unit 10provided with a plurality of pixels P arranged on a two-dimensionalplane. Examples of the arrangement on the two-dimensional plane includea diagonal arrangement, a delta arrangement, a honeycomb arrangement,and various other two-dimensional arrangements.

FIG. 2 is a diagram schematically depicting a cross-sectional shape ofthe pixel. As depicted in this figure, each pixel P includes: aphotodiode 20 as a photoelectric conversion unit that generates anelectrical signal according to incident light; and a microlens 30provided separately from a light receiving surface of the photodiode 20.

In addition to the photodiodes 20 and the microlenses 30, part or all ofthe plurality of pixels P include light shielding portions 40 providedbetween the photodiodes 20 and the microlenses 30. Hereinafter, thepixels including the light shielding portions 40 will be referred to aspixels Ph. The light shielding portion 40 includes an edge portion 41formed across over the light receiving surface of the photodiode 20.

FIGS. 3 to 11 are diagrams describing first edge portions 411 and secondedge portions 412 in the edge portions 41 of various light shieldingportions 40.

The light shielding portion 40 includes the edge portion 41 formedacross over the light receiving surface of the photodiode 20, and theedge portion 41 includes the first edge portion 411 and the second edgeportion 412 at positions different from each other both in a firstdirection D1 corresponding to an up and down direction in an outputimage of the solid-state imaging device 100 and a second direction D2corresponding to a left and right direction of the output image.

In the light shielding portion 40 depicted in FIG. 3(a), the edgeportion 41 connects an upper side and a lower side of a pixel Ph1. Inthe light shielding portion 40 depicted in FIG. 3(b), the edge portion41 connects an upper side and a lower side of a pixel Ph2. The edgeportion 41 is formed substantially in the first direction D1 (directioncorresponding to the up and down direction in the output image of thesolid-state imaging device 100) across over the light receiving surfaceof the photodiode 20. The edge portions 41 of the pixels Ph1 and Ph2each include a stepped portion 41G on the midway of the edge portion 41formed across over the light receiving surface of the photodiode 20. Thestepped portion 41G is a part of the edge portion 41 extending in thesecond direction D2 different from the first direction D1.

In the edge portion 41, one side across the stepped portion 41Gconstitutes the first edge portion 411, and the other side across thestepped portion 41G constitutes the second edge portion 412. The firstedge portion 411 and the second edge portion 412 are provided such thatat least one radiation ray Dr extending from an optical axis center 11 c(see FIG. 9) of the light receiving surface 10 of the solid-stateimaging device 100 intersects with both the first edge portion 411 andthe second edge portion 412.

Therefore, the first edge portion 411 and the second edge portion 412are provided at different positions in the first direction D1 and arealso provided at different positions in the second direction D2 due tothe offset by the stepped portion 41G.

Note that, although the number of stepped portions 41G is one in theexample illustrated in FIG. 3, the number of stepped portions 41G is notlimited to this, and two or more arbitrary number of stepped portions41G may be provided on the edge portion 41 to divide the edge portioninto three or more portions. All of the edge portions divided by thestepped portions 41G are provided to intersect with at least oneradiation ray Dr extending from the optical axis center 11 c of thelight receiving surface 10 of the solid-state imaging device 100.

In the light shielding portion 40 depicted in FIG. 4(a), the edgeportion 41 connects a left side and a right side of the pixel Ph1. Inthe light shielding portion 40 depicted in FIG. 4(b), the edge portion41 connects a left side and a right side of the pixel Ph2. The edgeportion 41 is formed substantially in the second direction D2 (directioncorresponding to the left and right direction in the output image of thesolid-state imaging device 100) across over the light receiving surfaceof the photodiode 20. The edge portions 41 of the pixels Ph1 and Ph2each include the stepped portion 41G on the midway of the edge portion41 formed across over the light receiving surface of the photodiode 20.The stepped portion 41G is a part of the edge portion 41 extending inthe first direction D1 different from the second direction D2.

In the edge portion 41, one side across the stepped portion 41Gconstitutes the first edge portion 411, and the other side across thestepped portion 41G constitutes the second edge portion 412. The firstedge portion 411 and the second edge portion 412 are provided such thatat least one radiation ray Dr extending from the optical axis center 11c of the light receiving surface 10 of the solid-state imaging device100 intersects with both the first edge portion 411 and the second edgeportion 412.

Therefore, the first edge portion 411 and the second edge portion 412are provided at different positions in the second direction D2 and arealso provided at different positions in the first direction D1 due tothe offset by the stepped portion 41G.

Note that, although the number of stepped portions 41G is one in theexample illustrated in FIG. 4, the number of stepped portions 41G is notlimited to this, and two or more arbitrary number of stepped portions41G may be provided on the edge portion 41 to divide the edge portioninto three or more portions. All of the edge portions divided by thestepped portions 41G are provided to intersect with at least oneradiation ray Dr extending from the optical axis center 11 c of thelight receiving surface 10 of the solid-state imaging device 100.

In the light shielding portion 40 depicted in FIG. 5(a), the edgeportion 41 connects the upper side and the lower side of the pixel Ph1.In the light shielding portion 40 depicted in FIG. 5(b), the edgeportion 41 connects the upper side and the lower side of the pixel Ph2.The edge portion 41 is formed across over the light receiving unit 10 ofthe photodiode 20 in a third direction D3 different from both the firstdirection D1 and the second direction D2. Therefore, the edge portions41 of the pixels Ph1 and Ph2 have a shape extending in a directioninclined with respect to the up and down and left and right directions.

In the edge portion 41 extending in the third direction D3, differentparts constitute the first edge portion 411 and the second edge portion412. The edge portion 41 extends in the third direction D3 differentfrom both the first direction D1 and the second direction D2, and thepositions of the first edge portion 411 and the second edge portion 412are different both in the second direction D2 and the first directionD1.

Note that, although two edge portions, the first edge portion 411 andthe second edge portion 412, are set on the edge portion 41 in theexample illustrated in FIG. 5, an arbitrary number of edge portionsother than the first edge portion 411 and the second edge portion 412can be set on the edge portion 41. The first edge portion 411, thesecond edge portion 412, and the other edge portions set on the edgeportion 41 all intersect with at least one radiation ray Dr extendingfrom the optical axis center 11 c of the light receiving surface 10 ofthe solid-state imaging device 100.

In the light shielding portion 40 depicted in FIG. 6(a), the edgeportion 41 connects the left side and the right side of the pixel Ph1.In the light shielding portion 40 depicted in FIG. 6(b), the edgeportion 41 connects the left side and the right side of the pixel Ph2.The edge portion 41 is formed across over the light receiving unit 10 ofthe photodiode 20 in a fourth direction D4 different from both the firstdirection D1 and the second direction D2. Therefore, the edge portions41 of the pixels Ph1 and Ph2 have a shape extending in a directioninclined with respect to the up and down and left and right directions.

In the edge portion 41 extending in the fourth direction D4, differentparts constitute the first edge portion 411 and the second edge portion412. The edge portion 41 extends in the fourth direction D4 differentfrom both the first direction D1 and the second direction D2, and thepositions of the first edge portion 411 and the second edge portion 412are different both in the second direction D2 and the first directionD1.

Note that, although two edge portions, the first edge portion 411 andthe second edge portion 412, are set on the edge portion 41 in theexample illustrated in FIG. 5, an arbitrary number of edge portionsother than the first edge portion 411 and the second edge portion 412can be set on the edge portion 41. The first edge portion 411, thesecond edge portion 412, and the other edge portions set on the edgeportion 41 all intersect with at least one radiation ray Dr extendingfrom the optical axis center 11 c of the light receiving surface 10 ofthe solid-state imaging device 100.

In the light shielding portions 40 depicted in FIG. 7, the edge portions41 connect the upper sides and the lower sides of the pixels Ph1 and Ph2as in the light shielding portions 40 depicted in FIG. 5, and the edgeportions 41 are formed across over the light receiving surfaces of thephotodiodes 20 in the third direction D3 different from both the firstdirection D1 and the second direction D2. However, the edge portions 41depicted in FIG. 7 are formed in zigzags with combinations of directionlines extending in directions different from the third direction D3(first direction D1 and second direction D2 in FIG. 7).

The first edge portion 411 and the second edge portion 412 areseparately provided on the direction line extending in the firstdirection D1 on the edge portion 41 extending in the third direction D3.As a result, the edge portion 41 includes the first edge portion 411 andthe second edge portion 412 at positions different from each other bothin the first direction D1 and the second direction D2. Note that theedge portion 41 of the light shielding portion 40 of the pixel Phdepicted in FIG. 3 described above can be considered as one of the modeswith the zigzag edge portion 41 depicted in FIG. 7.

In the light shielding portions 40 depicted in FIG. 8, the edge portions41 connect the left sides and the right sides of the pixels Ph1 and Ph2as in the light shielding portions 40 depicted in FIG. 6, and the edgeportions 41 are formed across over the light receiving surfaces of thephotodiodes 20 in the fourth direction D4 different from both the firstdirection D1 and the second direction D2. However, the edge portions 41depicted in FIG. 8 are formed in zigzags with combinations of directionlines extending in directions different from the fourth direction D4(first direction D1 and second direction D2 in FIG. 8).

The first edge portion 411 and the second edge portion 412 areseparately provided on the direction line extending in the seconddirection D2 on the edge portion 41 extending in the fourth directionD4. As a result, the edge portion 41 includes the first edge portion 411and the second edge portion 412 at positions different from each otherboth in the first direction D1 and the second direction D2. Note thatthe edge portion 41 of the light shielding portion 40 of the pixel Phdepicted in FIG. 4 described above can be considered as one of the modeswith the zigzag edge portion 41 depicted in FIG. 8.

In the light shielding portions 40 of the pixels Ph1 and Ph2 depicted inFIG. 9, the edge portions 41 are formed across the pixels Ph1 and Ph2along the radiation ray Dr from the optical axis center 11 c of thelight receiving surface 10 of the solid-state imaging device 100. Notethat the edge portions 41 depicted in FIG. 9 may also be formed inzigzags with combinations of direction lines different from theradiation ray Dr as in the examples depicted in FIGS. 7 and 8. The firstedge portions 411 and the second edge portions 412 are separatelyprovided on the edge portions 41 extending along the radiation ray Dr.

Note that when the edge portion 41 is formed along the radiation ray Dras in the light shielding portion 40 of the pixel Ph depicted in FIG. 9,the edge portion 41 may extend in the first direction D1 or the seconddirection D2, and in this case, the first edge portion 411 and thesecond edge portion 412 may be provided at the same positions in thefirst direction D1 or the second direction D2. Further, when the edgeportion 41 extends in the first direction D1 or the second direction D2,the edge portion 41 does not have to be formed in a zigzag with acombination of direction lines different from the radiation ray Dr.

FIG. 10 is a diagram comparing, in the solid-state imaging device 100,step widths of the pixels Ph including the stepped portions 41G in theedge portions 41. FIG. 10 depicts a state in which the plurality ofpixels Ph are arranged in a line.

In the plurality of pixels Ph, the step widths of the stepped portions41G gradually increase according to the degree of separation from theoptical axis center 11 c of the light receiving surface 10. Morespecifically, the step widths of the stepped portions 41G are d1, d2,d3, d4, d5, and d6 in ascending order of the distance from the opticalaxis center to the pixel Ph, and the step widths have a magnituderelation of d1<d2<d3<d4<d5<d6.

FIG. 11 is a diagram comparing, in the solid-state imaging device 100,inclination angles of the pixels Ph with inclinations on the edgeportions 41. FIG. 11 depicts a state in which the plurality of pixels Phare arranged in a line. The inclination angles of the plurality ofpixels Ph gradually increase according to the degree of separation fromthe optical axis center 11 c of the light receiving surface 10. Morespecifically, the inclination angles are θ1, θ2, θ3, Θ4, θ5, and θ6 inascending order of the distance from the optical axis center to thepixel Ph, and the step widths have a magnitude relation ofθ1<θ2<θ3<θ4<θ5<θ6.

There are two types of pixels Ph depicted in FIGS. 3 to 11, the pixelPh1 and the pixel Ph2 ((a) and (b) in the examples depicted in FIGS. 3to 8) having shapes rotated 180° from each other with the pixel centeras the axis of point symmetry. More specifically, there are two types ofpixels Ph: the pixel Ph1 with one side shielded and the other sideopened across the edge portion 41; and the pixel Ph2 with one sideopened and the other side shielded across the edge portion 41.

As for the positional relation between the pixel Ph1 and the pixel Ph2,at least one pixel Ph2 is disposed within a certain range from the pixelPh1, and at least one pixel Ph1 is disposed within a certain range fromthe pixel Ph2. The certain range is about one to several pixels and is aclose range that allows assuming that the chief ray angles of theincident light entering the pixels are substantially equal. Therefore,an imaging apparatus 200 described later can compare light receptionresults of the pixel Ph1 and the pixel Ph2 within the certain range fromthe pixel Ph1 to perform focus determination.

FIG. 12 is a diagram describing positions and arrangement direction ofthe pixels Ph including the light shielding portions 40 depicted inFIGS. 3 to 8 on the solid-state imaging device 100.

The pixels Ph depicted in FIGS. 3 to 8 are mainly provided at a cornersection of the light receiving surface 100 of the solid-state imagingdevice 100. In the example depicted in FIG. 10, the corner sectiondenotes a pixel area excluding pixels intersecting with a first line L1,which passes through the optical axis center 11 c and extends in thefirst direction D1, and a second line L2, which passes through theoptical axis center 11 c and extends in the second direction D2. Notethat this is not intended to prohibit providing the pixels Ph at asection intersecting with the first line L1 or the second line L2. Onthe other hand, the pixels Ph depicted in FIG. 9 can be provided atarbitrary positions on the light receiving surface 10 includingpositions on the first line L1 and positions on the second line L2.

The pixels Ph are separately or continuously lined up and arranged in awave detection direction Dd appropriately selected by the imagingapparatus 200 described later. In the example depicted in FIG. 12, thesecond direction D2 corresponding to the left and right direction in theoutput image of the solid-state imaging device 100 is the wave detectiondirection Dd, and a phase difference detection pixel group PL includingthe plurality of pixels Ph lined up and arranged in the wave detectiondirection Dd is provided. In the phase difference detection pixel groupPL, the pixels Ph1 and the pixels Ph2 are provided in substantiallyequal proportions as a whole, and for example, the pixels Ph1 and thepixels Ph2 are alternately provided.

The solid-state imaging device 100 described above can be realized invarious specific modes, and an example of the specific modes will bedescribed below.

FIG. 13 is a block diagram depicting a configuration of the solid-stateimaging device 100. Note that, although a CMOS (Complementary MetalOxide Semiconductor) image sensor that is a kind of an X-Y address typesolid-state imaging device will be described as an example of thesolid-state imaging device in the present embodiment, it is obvious thata CCD (Charge Coupled Device) image sensor may be adopted. A specificexample of the solid-state imaging device as a CMOS image sensor will bedescribed with reference to FIG. 13.

In FIG. 13, the solid-state imaging device 100 includes a pixel unit121, a vertical drive unit 122, an analog digital conversion unit 123(AD conversion unit 123), a reference signal generation unit 124, ahorizontal drive unit 125, a communication timing control unit 126, anda signal processing unit 127.

The plurality of pixels P including photodiodes as photoelectricconversion units are arranged in a two-dimensional matrix on the pixelunit 121. The photodiodes generate electrical signals according to theamounts of received light. A color filter array with colors of filtersdivided according to the pixels is provided on a light receiving surfaceside of the pixel unit 121.

On the pixel unit 121, n pixel drive lines HSLn (n=1, 2, . . . ) and mvertical signal lines VSLm (m=1, 2, . . . ) are wired. The pixel drivelines HSLn are wired in the left and right direction of the figure(pixel arrangement direction of pixel rows, or horizontal direction) andare arranged at equal intervals in the up and down direction of thefigure. The vertical signal lines VSLm are wired in the up and downdirection of the figure (pixel arrangement direction of pixel columns,or vertical direction) and are arranged at equal intervals in the leftand right direction of the figure.

One end of the pixel drive line HSLn is connected to an output terminalcorresponding to each row of the vertical drive unit 122. The verticalsignal line VSLm is connected to the pixel P of each column, and one endof the vertical signal line VSLm is connected to the AD conversion unit123. Under the control of the communication timing control unit 126, thevertical drive unit 122 and the horizontal drive unit 125 performcontrol of sequentially reading, from the pixels P included in the pixelunit 121, analog electrical signals generated by photodiodes PDaccording to the amounts of received light.

The communication timing control unit 126 includes, for example, atiming generator and a communication interface. The timing generatorgenerates various clock signals based on a clock (master clock) inputfrom the outside. The communication interface receives data forinstructing an operation mode or the like provided from the outside ofthe solid-state imaging device 100 and outputs data including internalinformation of the solid-state imaging device 100 to the outside.

Based on the master clock, the communication timing control unit 126generates a clock at the same frequency as the master clock, a clockobtained by dividing the frequency by two, a low-speed clock obtained byfurther dividing the frequency, and the like and supplies the clocks tothe units in the device (such as vertical drive unit 122, horizontaldrive unit 125, AD conversion unit 123, reference signal generation unit124, and signal processing unit 127).

The vertical drive unit 122 is constituted by, for example, a shiftregister and an address decoder. The vertical drive unit 122 includes avertical address setting unit that controls row addresses and a rowscanning control unit that controls row scanning based on a decodedsignal of a video signal input from the outside.

The vertical drive unit 122 can perform read scanning and sweepscanning.

The read scanning is a scan for sequentially selecting unit pixels fromwhich the signals will be read. Although the read scanning is basicallyperformed row by row, the read scanning is performed in a predeterminedorder when the pixels are reduced based on a sum or arithmetic means ofthe outputs of a plurality of pixels in a predetermined positionalrelation.

The sweep scanning is a scan performed for a row or a combination ofpixels to be read in the read scanning, in which a unit pixel belongingto the row or the combination of pixels to be read is reset earlier thanthe read scanning by a time period equivalent to the shutter speed.

The horizontal drive unit 125 sequentially selects ADC circuitsconstituting the AD conversion unit 123 in synchronization with theclock output by the communication timing control unit 126. The ADconversion unit 123 includes ADC circuits provided for the respectivevertical signal lines VSLm (m=1, 2, . . . ). The AD conversion unit 123converts analog signals output from the vertical signal lines VSLm intodigital signals and outputs the digital signals to a horizontal signalline Ltrf according to the control by the horizontal drive unit 125.

The horizontal drive unit 125 includes, for example, a horizontaladdress setting unit and a horizontal scan unit. The horizontal driveunit 125 selects individual ADC circuits of the AD conversion unit 123corresponding to read columns in the horizontal direction defined by thehorizontal address setting unit to guide the digital signals generatedby the selected ADC circuits to the horizontal signal line Ltrf.

The digital signals output from the AD conversion unit 123 in this wayare input to the signal processing unit 127 through the horizontalsignal line Ltrf. The signal processing unit 127 executes a process ofconverting the signals output from the pixel unit 121 through the ADconversion unit 123 into image signals corresponding to the colorarrangement of the color filter array in a calculation process.

The signal processing unit 127 also executes a process of using a sum,arithmetic means, or the like to reduce the pixel signals in thehorizontal direction or the vertical direction as necessary. The imagesignals generated in this way are output to the outside of thesolid-state imaging device 100.

The reference signal generation unit 124 includes a DAC (Digital AnalogConverter) and generates a reference signal Vramp (see FIG. 4 and thelike described later) in synchronization with a count clock suppliedfrom the communication timing control unit 126. The reference signalVramp is a sawtooth wave (ramp waveform) that changes with time in astep-wise manner from an initial value supplied from the communicationtiming control unit 126. The reference signal Vramp is supplied to theindividual ADC circuits of the AD conversion unit 123.

The AD conversion unit 123 includes a plurality of ADC circuits. Whenthe ADC circuit performs AD conversion of an analog voltage output fromeach pixel P, a comparator compares the reference signal Vramp and thevoltage of the vertical signal line VSLm in a predetermined ADconversion period (P-phase period or D-phase period described later),and a counter counts the time before or after the inversion of themagnitude relation between the reference signal Vramp and the voltage(pixel voltage) of the voltage of the vertical signal line VSLm. As aresult, a digital signal corresponding to the analog pixel voltage canbe generated. Note that a specific example of the AD conversion unit 123will be described later.

FIG. 14 is a cross-sectional diagram of a structure of main parts of aback-side illuminated solid-state imaging device 300. Note that,although an example of a back-side illuminated CMOS image sensor will bedescribed in the present embodiment, it is obvious that the image sensoris not limited to this, and the present embodiment can also be appliedto a front-side illuminated CMOS image sensor and a back-sideilluminated or front-side illuminated CCD image sensor.

Further, the structure of the solid-state imaging device 300 describedlater is an example, and the light condensing structure is not limitedto the structure. Furthermore, for example, a lens in layer forincreasing the light condensing power, a light shielding wall providedbetween the pixels from an interlayer insulating film 321 to a colorfilter layer 318 to prevent mixed colors or flare, and the like may becombined.

The solid-state imaging device 300 depicted in the figure is a back-sideilluminated CMOS image sensor and is provided with, for example: a pixelregion 310 (so-called imaging region) including a plurality of unitpixels 311 arranged on a semiconductor substrate 301 made of silicon;and a peripheral circuit unit (not depicted) arranged around the pixelregion 310.

Pixel transistors are formed on the side of a substrate front surface301A, and gate electrodes 312 are illustrated in FIG. 14 toschematically indicate the existence of the pixel transistors. Thephotodiodes PD are isolated by device isolation regions 313 made of animpurity diffusion layer.

On the front surface side provided with the pixel transistors of thesemiconductor substrate 301, a multilayer wiring layer 316 provided witha plurality of wires 314 is formed through an interlayer insulating film315. Therefore, the wires 314 can be formed regardless of the positionsof the photodiodes PD in the back-side illuminated CMOS image sensor.

The interlayer insulating film 321 that functions as a reflectionprevention film is formed on a back surface 301B facing the photodiodesPD of the semiconductor substrate 301. The interlayer insulating film321 has a laminate structure in which a plurality of films withdifferent refractive indices are laminated.

The interlayer insulating film 321 is constituted by, for example, atwo-layer structure including a hafnium oxide (HfO₂) film and a siliconoxide film (SiO₂) sequentially laminated from the side of thesemiconductor substrate 301. The hafnium oxide film is a high dielectricinsulating layer (high-k film) with a dielectric constant higher thanthe silicon oxide film. Alternatively, a silicon nitride film may beused for the interlayer insulating film 321.

A light shielding film 320 is formed on the interlayer insulating film321. The light shielding film 320 can be made of a material that blockslight, and the light shielding film 320 is preferably formed by amaterial with a high light shielding property that can bemicrofabricated, such as a material that can be accurately processed byetching. More specifically, examples of the material include aluminum(Al), tungsten (W), and copper (Cu). The light shielding film 320 isequivalent to the light shielding portion 40 of the above-describedsolid-state imaging device 100. Note that, in the case of a front-sideilluminated image sensor, a wiring layer provided between thephotodiodes and the color filter layer may be used in place of the lightshielding film 320 to constitute the light shielding portion 40.

A planarization film 317 is formed as necessary on the interlayerinsulating film 321 and the light shielding film 320, and the colorfilter layer 318 including a plurality of color filters formed tocorrespond to the respective positions of the photodiodes PD is formedon the planarization film 317. Note that the planarization film 317 maynot be formed if the difference in level of the upper surfaces of theinterlayer insulating film 321 and the planarization film 317 can beaccepted.

Microlenses 319 corresponding to the respective photodiodes PD areformed on the upper surface of the color filter layer 318. Themicrolenses 319 are provided on the back surface of the semiconductorsubstrate 301 and above the light shielding film 320 as depicted in FIG.14. The plurality of microlenses 319 in the same shape are arranged tocorrespond to the plurality of photodiodes PD arranged in the pixelregion 310. The microlens 319 is a convex lens in which the center isformed thicker than the edges in a direction from a light receivingsurface JS toward the color filter layer 318.

(B) Second Embodiment

Next, the imaging apparatus 200 including the solid-state imaging deviceaccording to the above-described first embodiment will be described.FIG. 15 is a diagram describing an example of a functional configurationof the imaging apparatus according to the present embodiment.

The imaging apparatus 200 is an imaging apparatus that images a subjectto generate image data (captured image) and that records the generatedimage data as image content (still image content or video content). Notethat an example of recording still image content (still image file) asimage content (image file) will be mainly illustrated.

The imaging apparatus 200 includes a lens unit 210, an operation unit220, a control unit 230, a solid-state imaging device 240, a signalprocessing unit 250, a storage unit 260, a display unit 270, a focusdetermination unit 280, and a drive unit 290. The solid-state imagingdevice 240 is constituted by the solid-state imaging device 100according to the first embodiment described above.

The lens unit 210 condenses light from the subject (subject light). Thelens unit 210 includes, for example, a zoom lens 211, a diaphragm 212, afocus lens 213, and a lens control unit 214 (not depicted).

The lens unit 210 can be interchanged in the present embodiment, and anexample of a case in which a first lens unit 210A and a second lens unit210B are interchangeable will be described as necessary. Note that thenumber of interchangeable lens units may be two or more, and in thatcase, the number of edge portions divided by the above-described steppedportions 41G is increased according to the number of chief ray angles ofthe incident light entering the pixels (or the number of groups of aplurality of lenses or zoom positions with similar properties of chiefray angle). Note that it is assumed that the case in which the firstlens unit 210A is installed on the imaging apparatus 200 and the case inwhich the second lens unit 210B is installed on the imaging apparatus200 have different chief ray incident angles of the light entering thepixels.

The drive unit 290 drives the zoom lens 211 to move the zoom lens 211 inthe optical axis direction to change the focal length, and the zoom lens211 changes the magnification of the subject included in the capturedimage. The drive unit 290 drives the diaphragm 212 to change the degreeof opening, and the diaphragm 212 adjusts the amount of subject lightentering the solid-state imaging device 240. The drive unit 290 drivesthe focus lens 213 to move the focus lens 213 in the optical axisdirection, and the focus lens 213 adjusts the focus of the lightincident on the solid-state imaging device 240.

The operation unit 220 receives an operation from the user. When, forexample, a shutter button is pressed and operated, the operation unit220 supplies the control unit 230 with an operation signal that is asignal corresponding to the pressing operation.

The control unit 230 controls the operation of each unit constitutingthe imaging apparatus 200. For example, when the focus determination isto be performed by a phase difference detection system, the control unit230 supplies the signal processing unit 250 with a signal (phasedifference detection operation signal) indicating an operation ofperforming the focus determination (phase difference detectionoperation). The phase difference detection system is a focus detectionmethod, in which the light passing through the imaging lens ispupil-divided to form a pair of images, and the interval between theformed images (amount of deviation between the images) is measured(phase difference is detected) to detect the degree of focus.

The solid-state imaging device 240 receives the subject light andphotoelectrically converts the received subject light into an electricalsignal.

The solid-state imaging device 240 is provided with pixels (imagegeneration pixels) that generate signals for generating the capturedimage based on the received subject light and pixels (phase differencedetection pixels) that generate signals for performing phase differencedetection. The solid-state imaging device 240 supplies the signalprocessing unit 250 with the electrical signal generated by thephotoelectric conversion.

The signal processing unit 250 applies various types of signalprocessing to the electrical signal supplied from the solid-stateimaging device 240. When, for example, a still image imaging operationsignal is supplied from the control unit 230, the signal processing unit250 applies various types of signal processing to generate data of astill image (still image data). The signal processing unit 250 suppliesthe generated image data to the storage unit 260 and causes the storageunit 260 to store the image data.

When a phase difference detection operation signal is supplied from thecontrol unit 230, the signal processing unit 250 generates data fordetecting the phase difference (phase difference detection data) basedon the output signals from the phase difference detection pixels of thesolid-state imaging device 240. The signal processing unit 250 suppliesthe generated phase difference detection data to the focus determinationunit 280.

When a live view display signal is supplied from the control unit 230,the signal processing unit 250 generates data of a live view image (liveview image data) based on the output signals from the image generationpixels in the solid-state imaging device 240. The signal processing unit250 supplies the generated live view image data to the display unit 270.

The storage unit 260 records image content (image file) that is theimage data supplied from the signal processing unit 250. A semiconductormemory or other removable recording media or built-in recording mediacan be used as the storage unit 260, for example.

The display unit 270 displays the image on a display screen based on theimage data supplied from the signal processing unit 250. The displayunit 270 is realized by, for example, a liquid crystal panel. Thedisplay unit 270 displays a live view image on the display screen when,for example, the live view image data is supplied from the signalprocessing unit 250.

The focus determination unit 280 determines whether or not the object tobe focused (focusing target) is focused based on the phase differencedetection data supplied from the signal processing unit 250.

When the object (focusing target) in a region for focusing (focus area)is focused, the focus determination unit 280 supplies the drive unit 290with focus determination result information that is informationindicating that the focusing target is focused.

When the focusing target in the focus area is not focused, the focusdetermination unit 280 calculates an amount of deviation of focus(amount of defocus) and supplies the drive unit 290 with focusdetermination result information that is information indicating thecalculated amount of defocus.

Here, an example of the calculation of the amount of defocus willdescribed. FIG. 16 is a schematic diagram depicting an example of pixelarrangement in the solid-state imaging device 240. In this figure, theup and down direction will be referred to as a Y axis, and the left andright direction will be referred to as an X axis. The reading directionof the signal in the solid-state imaging device 240 will be referred toas an X-axis direction (signal is read row by row). In the presentembodiment, the wave detection direction Dd is the X-axis direction.

In the solid-state imaging device 240, rows provided with the imagegeneration pixels and rows provided with the phase difference detectionpixels are alternately arranged. In the example depicted in FIG. 16, thephase difference detection pixel group PL, an image generation pixelgroup PG, the phase difference detection pixel group PL, the imagegeneration pixel group PG, . . . including the pixels constituting thepixel groups lined up in the X-axis direction are alternately arrangedin the Y-axis direction.

In the solid-state imaging device 240, lines PL1 and lines PL2 arealternately arranged across the image generation pixel groups PG, inwhich the pixels Ph1 with openings on the left sides of the edgeportions 41 and the pixels Ph2 with openings on the right sides of theedge portions 41 are alternately arranged in the lines PL1, and thepixels Ph1 with openings on the upper sides of the edge portions 41 andthe pixels Ph2 with openings on the lower sides of the edge portions 41are alternately arranged in the lines PL2. More specifically, the phasedifference detection pixels for performing the pupil division in thesame direction (reading direction (left and right) or directionorthogonal to the reading direction (up and down)) are arranged row byrow in the phase difference detection pixel group PL.

FIG. 17 is a diagram describing received light data obtained from thepixels Ph. This figure depicts received light data obtained from theline PL1. The layout direction of the line PL1 is equivalent to the wavedetection direction Dd. Hereinafter, received light data obtained fromthe pixels Ph1 in the received light data obtained from the line PL1will be referred to as received light data Da, and received light dataobtained from the pixels Ph2 will be referred to as received light dataDb.

Comparing the received light data Da and the received light data Db,data series of the received light data Da and data series of thereceived light data Db have substantially similar waveforms and haveshapes offset from each other in the wave detection direction Dd at thephase difference corresponding to the amount of defocus. The larger theamount of defocus, the larger the amount of phase difference (amount ofhorizontal deviation) between the data series of the received light dataDa and the data series of the received light data Db.

The amount of phase difference between the data series of the receivedlight data Da and the data series of the received light data Db can becalculated by various operations, and for example, the amount of phasedifference can be calculated based on the difference between the centersof gravity of the received light data. The distance to the subject canbe calculated based on the amount of phase difference. Note that theamount of phase difference can also be obtained by calculating thecorrelation between the data series of the received light data Da andthe data series of the received light data Db. Various well-knownmethods or methods developed in the future can be adopted to obtain theevaluation value of the amount of correlation between the data series ofthe received light data Da and the data series of the received lightdata Db.

For example, there is a method of shifting one of the waveform data(curves) on a pixel-by-pixel basis to calculate the sum of thedifferences between the curve and the other curve and obtaining theamount of phase difference from the distance where the sum is thesmallest. More specifically, integrated values of the absolute values ofthe differences between the points constituting the received light dataDa and the points constituting the received light data Db are obtained,and the difference between the points where the integrated value is thesmallest is set as the amount of phase difference. Hereinafter, thesmallest integrated value will be referred to as a correlation value.The higher the correlation between the received light data Da and thereceived light data Db, the smaller the smallest value of thecorrelation value.

The amount of offset and the amount of defocus of the data series of thereceived light data Da and the data series of the received light data Dbhave a proportional relation, and a proportionality factor of theproportional relation can be acquired in advance in a factory test orthe like.

The focus determination unit 280 calculates the amount of defocus fromthe amount of phase difference between the data series of the receivedlight data Da and the data series of the received light data Db andprovides an amount of drive equivalent to the calculated amount ofdefocus to the drive unit 290. Note that the relation between the amountof defocus and the amount of drive of the focus lens 213 is uniquelydetermined by design values of the lens unit 210 installed on theimaging apparatus 200.

The drive unit 290 drives the zoom lens 211, the diaphragm 212, and thefocus lens 213 constituting the lens unit 210.

The drive unit 290 calculates the amount of drive of the focus lens 213based on, for example, the focus determination result information outputfrom the focus determination unit 280 and moves the focus lens 213according to the calculated amount of drive. In this way, the auto focus(AF) control is executed, in which the focus lens 213 is moved to thefocus position detected by the focus determination unit 280.

When the object is focused, the drive unit 290 maintains the currentposition of the focus lens 213. When the focus is deviated, the driveunit 290 calculates the amount of drive (moving distance) based on thefocus determination result information indicating the amount of defocusand the position information of the focus lens 213 and moves the focuslens 213 according to the amount of drive.

FIG. 18 is a diagram describing imaging positions during focusing in thepixels Ph. The example of this figure illustrates a case in which twotypes of different chief ray angles are switched and used regarding theincident light entering the pixels (when the first lens unit 210A andthe second lens unit 210B are interchanged and used or when the zoomposition is switched and used). For example, when the first lens unit210A and the second lens unit 210B are interchanged and used, thepositions of the first edge portion 411 and the second edge portion 412are adjusted in the pixels Ph1 and Ph2, such that the light is condensednear the first edge portion 411 when the first lens unit 210A is usedfor focusing, and the light is condensed near the second edge portion412 when the second lens unit 210B is used for focusing. This allows touse the same phase difference detection pixel groups PL to perform thefocus determination of two types of lens units with different chief rayangles or two types of zoom positions with different chief ray angles.

FIG. 19 is a diagram describing imaging positions during focusing in thepixels Ph. The example of this figure illustrates a case in which threeor more different chief ray angles are switched and used regarding theincident light entering the pixels (when a plurality of types of lensunits are interchanged and used or when a plurality of zoom positionsare switched and used). In this case, the positions of the first edgeportion 411 and the second edge portion 412 are adjusted in the pixelsPh1 and Ph2, such that the light is condensed near the first edgeportions 411 when the lens units or the zoom positions (first chief rayangle group G1) with chief ray angles within a certain range from afirst chief ray angle are used for focusing, and the light is condensednear the second edge portions 412 when the lens units or the zoompositions (second chief ray angle group G2) with chief ray angles withina certain range from a second chief ray angle are used for focusing.This allows to use the same phase difference detection pixel groups PLto perform the focus determination of a plurality of types of lens unitsor zoom positions belonging to the first chief ray angle group G1 andthe second chief ray angle group G2.

FIG. 20 is a diagram describing influence on the received lightintensity caused by the installation of the stepped portion 41G on themidway of the edge portion 41.

As in the pixel Ph1 depicted in FIG. 20(a), when the light is condensedon the first edge portion 411 adjacent to the projecting angle of thestepped portion 41G, part of the light that would be cut by the lightshielding portion 40 without the stepped portion 41G excessively entersthe photodiode PD as edge leakage light from the stepped portion 41G. Onthe other hand, when the light is condensed adjacent to the recessedangle of the stepped portion 41G as in the pixel Ph2 depicted in FIG.20(b), the light shielding portion 40 excessively cuts part of the lightthat would enter the photodiode PD without the stepped portion 41G.

Therefore, the imaging apparatus 200 according to the present embodimentis provided with a configuration for using calculation to adjust andremove the influence of the excessive edge leakage light components whenthe light is condensed on the edge portion adjacent to the projectingangle of the stepped portion 41G and the influence of the excessivelight shielding components when the light is condensed on the edgeportion adjacent to the recessed angle of the stepped portion 41G.

Specifically, for the received light data obtained from the pixel thatcondenses the light at the edge portion adjacent to the projecting angleof the stepped portion 41G, a predetermined amount is subtracted fromthe signal intensity, and then the amount of phase difference iscalculated. For the received light data obtained from the pixel thatcondenses the light at the edge portion adjacent to the recessed angleof the stepped portion 41G, a predetermined amount is added to thesignal intensity, and then the amount of phase difference is calculated.The amount of subtraction and the amount of addition are set in advanceby actual measurement, simulation, or the like. Obviously, the method ofadjusting the signal intensity can be appropriately changed, and thesubtraction or the addition may be performed by adding the amount ofaddition or the amount of subtraction of one of the received light datato the other received light data.

(C) Third Embodiment

Hereinafter, an example of a manufacturing method for manufacturing thesolid-state imaging device 300 will be described. FIGS. 21 to 26 arediagrams depicting main parts of the solid-state imaging device 300 insteps of the manufacturing method of the solid-state imaging device 300.Note that the manufacturing method of the above-described back-sideilluminated CMOS image sensor is illustrated in the present embodiment.

First, a first step is performed as depicted in FIG. 21, in which thephotodiodes PD as photoelectric conversion units are formed inaccordance with the pixels in the regions for forming the pixel regionsof the semiconductor substrate 301.

The photodiodes PD have pn junctions including: n-type semiconductorregions throughout the entire region in the substrate thicknessdirection; and p-type semiconductor regions formed in contact with then-type semiconductor regions and facing both the front and back sides ofthe substrate. The p-type semiconductor regions and the n-typesemiconductor regions are formed by, for example, using an ionimplantation method to introduce impurities to the semiconductorsubstrate. The photodiodes PD are isolated by device isolation regionsformed by p-type semiconductors.

In regions corresponding to the pixels of the substrate front surface301A, p-type semiconductor well regions contacting the respective deviceisolation regions are formed, and pixel transistors are formed in therespective p-type semiconductor well regions. The pixel transistors areeach formed by a source region, a drain region, a gate insulating film,and the gate electrode 312. Furthermore, the multilayer wiring layer 316including the wires 314 with a plurality of layers provided through theinterlayer insulating film 315 is formed on the upper part of thesubstrate front surface 301A.

Next, as depicted in FIG. 22, the interlayer insulating film 321 thatfunctions as a reflection prevention film is formed on the substrateback surface 301B serving as the light receiving surface. The interlayerinsulating film 321 can be formed by, for example, a two-layer filmincluding a silicon oxide film (SiO₂) and a hafnium oxide film (HfO₂)sequentially laminated from the back surface side of the semiconductorsubstrate 301. The hafnium oxide film is formed at a thickness optimalfor preventing reflection. The interlayer insulating film 321 is formedby, for example, a thermal oxidation method or a CVD (Chemical VaporDeposition) method.

Next, as depicted in FIG. 23, the light shielding film 320 is formed onthe substrate back surface 301B of the semiconductor substrate 301through the interlayer insulating film 321. Specifically, the lightshielding film 320 is formed by performing a deposition step ofdepositing a light shielding film on the entire surface of theinterlayer insulating film 321 and a pattern processing step ofprocessing the pattern by etching the light shielding film. Note that,although the light shielding film 320 may be independently formed, thelight shielding film 320 may be formed at the same time as theperipheral circuits or the light shielding films on the pixels thatdetermine the optical black level.

Preferably, the material of the light shielding film 320 has a highlight shielding property, and the material is suitable for delicateprocessing that can be accurately processed by, for example, etching.Examples of the material with such characteristics include metalmaterials such as aluminum (Al), tungsten (W), titanium (Ti), and copper(Cu).

The deposition step of the light shielding film 320 is performed by, forexample, a sputtering method, a CVD (Chemical Vapor Deposition) method,or a plating process. As a result, the metal film of aluminum or thelike is formed on the entire surface of the interlayer insulating film321.

In the pattern processing step of the light shielding film 320, a resistmask is formed along a part corresponding to the boundary between theimage generation pixels. As for the phase difference detection pixels, aresist mask is formed at a part corresponding to the boundary betweenthe pixels and on one of the sides shielded across the edge portion 41.The light shielding film 320 of the part not provided with the resistmask is selectively etched and removed by etching, such as wet etchingand dry etching.

As a result, the light shielding film 320 is formed along the boundarylines of the image generation pixels adjacent to each other, and apattern with openings at the parts of the light receiving surfaces ofthe photodiodes PD is formed. On the other hand, the light shieldingfilm 320 is similarly formed along the boundary lines of the phasedifference detection pixels, and the pixel Ph1 is formed such that oneside is shielded across the edge portion 41. The pixel Ph2 is formedsuch that the other side of the pixel Ph2 is shielded across the edgeportion 41.

Next, as depicted in FIG. 24, the transparent planarization film 317 isformed on the substrate back surface 301B through the interlayerinsulating film 321 and the light shielding film 320. The planarizationfilm 317 is formed by, for example, depositing a thermoplastic resin bya spin coating method and then executing a thermal curing process. Notethat the planarization film 317 may be formed by depositing an inorganicfilm, such as a silicon oxide film, and planarizing the film by chemicalmechanical polishing. As a result, the light shielding film 320 isprovided in the planarization film 317.

Next, the color filter layer 318 and partition walls 350 are formed onthe planarization film 317 as depicted in FIG. 25. The color filterlayer 318 and the partition walls 350 are formed by, for example, usinga coating method, such as a spin coating method, to apply a coatingliquid containing a coloring material, such as pigments and dyes, and aphotosensitive resin to form a coating film and then executing patternprocessing of the coating film based on a lithography technique.

The color filter of each color can be formed, for example, as follows.First, a coating liquid containing a coloring material for obtainingspectral characteristics of the color to be formed and a photosensitiveresin is applied by a spin coating method to deposit a photoresist film(not depicted). Subsequently, a prebaking process is applied, and thenthe pattern processing is applied to the photoresist film to form thecolor filter of a desirable color.

Next, the microlenses 319 are formed on the color filter layer 318 asdepicted in FIG. 26. The microlenses 319 are formed by, for example,depositing a positive photoresist film on the color filter layer 318 andthen processing the film. Here, the microlenses 319 are provided asconvex lenses with the centers thicker than the edges in the directionfrom the light receiving surface JS toward the color filter layer 318.

Examples of the material of the microlenses include organic materials,such as a styrene resin, an acrylic resin, a styrene acrylic copolymerresin, and a siloxane resin. To form the shape of the lens, for example,a photosensitive material containing a novolak resin as a mainingredient is used as a photoresist to form a pattern based on alithography technique, and a heat treatment is applied to the patternedphotoresist at a temperature higher than the thermal softening point toform the lens shape. The resist in the lens shape is used as a mask, anda dry etching method is used to transfer the pattern of the lens shapeto the lens material of the foundation. The lenses are formed on all thepixels. Note that the formation of the microlenses is not limited tothis method, and for example, a method may be adopted, in whichdeposition, prebaking, exposure, development, and bleaching exposureprocess of the lens material made of a photosensitive resin aresequentially performed, and then the heat treatment is applied to thematerial at a temperature higher than the thermal softening point of thephotosensitive resin.

The present technique is not limited to the above-described embodiments,and the present technique also includes: configurations obtained byreplacing the configurations disclosed in the above-describedembodiments with each other or configurations obtained by changing thecombinations of the configurations; configurations obtained by replacingwell-known techniques and the configurations disclosed in theabove-described embodiments with each other or configurations obtainedby changing the combinations of the techniques and the configurations;and the like. The technical range of the present technique is notlimited to the above-described embodiments, and the technical range alsoincludes the matters written in the claims and equivalents of thematters.

The present technique can have the following configurations.

(1)

A solid-state imaging device including:

a pixel including

-   -   a microlens that condenses light from a subject,    -   a photoelectric conversion unit that receives the subject light        condensed by the microlens to generate an electrical signal        according to an amount of received light, and    -   a light shielding portion provided between the photoelectric        conversion unit and the microlens,

in which the light shielding portion includes an edge portion formedacross over a light receiving surface of the photoelectric conversionunit, and

the edge portion includes a first edge portion and a second edge portionat positions different from each other both in a first directioncorresponding to an up and down direction of an output image and asecond direction corresponding to a left and right direction of theoutput image.

(2)

A solid-state imaging device including:

a pixel including

-   -   a microlens that condenses light from a subject,    -   a photoelectric conversion unit that receives the subject light        condensed by the microlens to generate an electrical signal        according to an amount of received light, and    -   a light shielding portion provided between the photoelectric        conversion unit and the microlens,

in which the light shielding portion includes an edge portion formedacross over a light receiving surface of the photoelectric conversionunit, and

the edge portion includes a stepped portion on a midway of the edgeportion.

(3)

A solid-state imaging device including:

a pixel including

-   -   a microlens that condenses light from a subject,    -   a photoelectric conversion unit that receives the subject light        condensed by the microlens to generate an electrical signal        according to an amount of received light, and    -   a light shielding portion provided between the photoelectric        conversion unit and the microlens,

in which the pixel is formed at a corner section of the solid-stateimaging device,

the light shielding portion includes an edge portion formed across overa light receiving surface of the photoelectric conversion unit, and

the edge portion is formed across over the light receiving surface ofthe photoelectric conversion unit in a third direction different fromboth a first direction corresponding to an up and down direction of anoutput image and a second direction corresponding to a left and rightdirection of the output image.

(4)

The solid-state imaging device according to (3), in which the thirddirection is a direction along a radiation ray extending from an opticalaxis center of a light receiving surface of the solid-state imagingdevice.

(5)

The solid-state imaging device according to (4), in which the edgeportion is formed in a zigzag by a combination of direction linesdifferent from the direction along the radiation ray.

(6)

The solid-state imaging device according to any one of (1) to (5),

in which the solid-state imaging device includes a plurality of pixels,

the pixels including the light shielding portions are provided in pairs,and

the light shielding portions of the pixels in pairs are formed to shielddifferent ranges of light receiving surfaces of the pixels.

(7)

An imaging apparatus including:

a solid-state imaging device including

-   -   a pixel including        -   a microlens that condenses light from a subject,        -   a photoelectric conversion unit that receives the subject            light condensed by the microlens to generate an electrical            signal according to an amount of received light, and        -   a light shielding portion provided between the photoelectric            conversion unit and the microlens,    -   in which the light shielding portion includes an edge portion        formed across over a light receiving surface of the        photoelectric conversion unit, and    -   the edge portion includes a first edge portion and a second edge        portion at positions different from each other both in a first        direction corresponding to an up and down direction of an output        image and a second direction corresponding to a left and right        direction of the output image; and

a focus determination unit that performs focus determination throughphase difference detection based on the signal generated by the pixel.

(8)

An imaging apparatus including:

a solid-state imaging device including

-   -   a pixel including        -   a microlens that condenses light from a subject,        -   a photoelectric conversion unit that receives the subject            light condensed by the microlens to generate an electrical            signal according to an amount of received light, and        -   a light shielding portion provided between the photoelectric            conversion unit and the microlens,    -   in which the light shielding portion includes an edge portion        formed across over a light receiving surface of the        photoelectric conversion unit, and    -   the edge portion includes a stepped portion on a midway of the        edge portion; and

a focus determination unit that performs focus determination throughphase difference detection based on the signal generated by the pixel.

(9)

An imaging apparatus including:

a solid-state imaging device including

-   -   a pixel including        -   a microlens that condenses light from a subject,        -   a photoelectric conversion unit that receives the subject            light condensed by the microlens to generate an electrical            signal according to an amount of received light, and        -   a light shielding portion provided between the photoelectric            conversion unit and the microlens,    -   in which the pixel is formed at a corner section of the        solid-state imaging device,    -   the light shielding portion includes an edge portion formed        across over a light receiving surface of the photoelectric        conversion unit, and    -   the edge portion is formed across over the light receiving        surface of the photoelectric conversion unit in a third        direction different from both a first direction corresponding to        an up and down direction of an output image and a second        direction corresponding to a left and right direction of the        output image; and

a focus determination unit that performs focus determination throughphase difference detection based on the signal generated by the pixel.

(10)

A manufacturing method of a solid-state imaging device, themanufacturing method including

a step of forming a pixel, the pixel including

-   -   a microlens that condenses light from a subject,    -   a photoelectric conversion unit that receives the subject light        condensed by the microlens to generate an electrical signal        according to an amount of received light, and    -   a light shielding portion provided between the photoelectric        conversion unit and the microlens,

in which the light shielding portion includes an edge portion formedacross over a light receiving surface of the photoelectric conversionunit, and

the edge portion includes a first edge portion and a second edge portionat positions different from each other both in a first directioncorresponding to an up and down direction of an output image and asecond direction corresponding to a left and right direction of theoutput image.

(11)

A manufacturing method of a solid-state imaging device, themanufacturing method including

a step of forming a pixel, the pixel including

-   -   a microlens that condenses light from a subject,    -   a photoelectric conversion unit that receives the subject light        condensed by the microlens to generate an electrical signal        according to an amount of received light, and    -   a light shielding portion provided between the photoelectric        conversion unit and the microlens,

in which the light shielding portion includes an edge portion formedacross over a light receiving surface of the photoelectric conversionunit, and

the edge portion includes a stepped portion on a midway of the edgeportion.

(12)

A manufacturing method of a solid-state imaging device, themanufacturing method including

a step of forming a pixel, the pixel including

-   -   a microlens that condenses light from a subject,    -   a photoelectric conversion unit that receives the subject light        condensed by the microlens to generate an electrical signal        according to an amount of received light, and    -   a light shielding portion provided between the photoelectric        conversion unit and the microlens,

in which the pixel is formed at a corner section of the solid-stateimaging device,

the light shielding portion includes an edge portion formed across overa light receiving surface of the photoelectric conversion unit, and

the edge portion is formed across over the light receiving surface ofthe photoelectric conversion unit in a third direction different fromboth a first direction corresponding to an up and down direction of anoutput image and a second direction corresponding to a left and rightdirection of the output image.

REFERENCE SIGNS LIST

10 . . . Light receiving unit, 12 . . . Solid-state imaging apparatus,20 . . . Photodiode, 11 . . . Light receiving surface 10 c . . . Opticalaxis center, 30 . . . Microlens, 40 . . . Light shielding portion, 41 .. . Edge portion, 41G . . . Stepped portion, 100 . . . Solid-stateimaging device, 110 . . . Light receiving surface, 121 . . . Pixel unit,122 . . . Vertical drive unit, 123 . . . Analog digital conversion unit(AD conversion unit), 124 . . . Reference signal generation unit, 125 .. . Horizontal drive unit, 126 . . . Timing control unit, 127 . . .Signal processing unit, 200 . . . Imaging apparatus, 210 . . . Lensunit, 210A . . . First lens unit, 210B . . . Second lens unit, 211 . . .Zoom lens, 212 . . . Diaphragm, 213 . . . Focus lens, 214 . . . Lenscontrol unit, 220 . . . Operation unit, 230 . . . Control unit, 240 . .. Solid-state imaging device, 250 . . . Signal processing unit, 260 . .. Storage unit, 270 . . . Display unit, 280 . . . Focus determinationunit, 290 . . . Drive unit, 300 . . . Solid-state imaging device, 301 .. . Semiconductor substrate, 301A . . . Substrate front surface, 301B .. . Substrate back surface, 310 . . . Pixel region, 311 . . . Unitpixel, 312 . . . Gate electrode, 313 . . . Device isolation region, 314. . . Wire, 315 . . . Interlayer insulating film, 316 . . . Multilayerwiring layer, 317 . . . Planarization film, 318 . . . Color filterlayer, 319 . . . Microlens, 320 . . . Light shielding film, 321 . . .Interlayer insulating film, 350 . . . Partition wall, 411 . . . Firstedge portion, 412 . . . Second edge portion, D1 . . . First direction,D2 . . . Second direction, D3 . . . Third direction, D4 . . . Fourthdirection, Da . . . Received light data, Db . . . Received light data,Dd . . . Wave detection direction, Dr . . . Radiation ray, G1 . . .First chief ray angle group, G2 . . . Second chief ray angle group, L1 .. . First line, L2 . . . Second line, P . . . Pixel, PD . . .Photodiode, PG . . . Image generation pixel group, PL . . . Phasedifference detection pixel group, Ph . . . Pixel, Ph1 . . . Pixel, Ph2 .. . Pixel

1. A solid-state imaging device comprising: a pixel including amicrolens that condenses light from a subject, a photoelectricconversion unit that receives the subject light condensed by themicrolens to generate an electrical signal according to an amount ofreceived light, and a light shielding portion provided between thephotoelectric conversion unit and the microlens, wherein the lightshielding portion includes an edge portion formed across over a lightreceiving surface of the photoelectric conversion unit, and the edgeportion includes a first edge portion and a second edge portion atpositions different from each other both in a first directioncorresponding to an up and down direction of an output image and asecond direction corresponding to a left and right direction of theoutput image.
 2. A solid-state imaging device comprising: a pixelincluding a microlens that condenses light from a subject, aphotoelectric conversion unit that receives the subject light condensedby the microlens to generate an electrical signal according to an amountof received light, and a light shielding portion provided between thephotoelectric conversion unit and the microlens, wherein the lightshielding portion includes an edge portion formed across over a lightreceiving surface of the photoelectric conversion unit, and the edgeportion includes a stepped portion on a midway of the edge portion.
 3. Asolid-state imaging device comprising: a pixel including a microlensthat condenses light from a subject, a photoelectric conversion unitthat receives the subject light condensed by the microlens to generatean electrical signal according to an amount of received light, and alight shielding portion provided between the photoelectric conversionunit and the microlens, wherein the pixel is formed at a corner sectionof the solid-state imaging device, the light shielding portion includesan edge portion formed across over a light receiving surface of thephotoelectric conversion unit, and the edge portion is formed acrossover the light receiving surface of the photoelectric conversion unit ina third direction different from both a first direction corresponding toan up and down direction of an output image and a second directioncorresponding to a left and right direction of the output image.
 4. Thesolid-state imaging device according to claim 3, wherein the thirddirection is a direction along a radiation ray extending from an opticalaxis center of a light receiving surface of the solid-state imagingdevice.
 5. The solid-state imaging device according to claim 4, whereinthe edge portion is formed in a zigzag by a combination of directionlines different from the direction along the radiation ray.
 6. Thesolid-state imaging device according to claim 5, wherein the solid-stateimaging device includes a plurality of pixels, the pixels including thelight shielding portions are provided in pairs, and the light shieldingportions of the pixels in pairs are formed to shield different ranges oflight receiving surfaces of the pixels.
 7. An imaging apparatuscomprising: a solid-state imaging device including a pixel including amicrolens that condenses light from a subject, a photoelectricconversion unit that receives the subject light condensed by themicrolens to generate an electrical signal according to an amount ofreceived light, and a light shielding portion provided between thephotoelectric conversion unit and the microlens, wherein the lightshielding portion includes an edge portion formed across over a lightreceiving surface of the photoelectric conversion unit, and the edgeportion includes a first edge portion and a second edge portion atpositions different from each other both in a first directioncorresponding to an up and down direction of an output image and asecond direction corresponding to a left and right direction of theoutput image; and a focus determination unit that performs focusdetermination through phase difference detection based on the signalgenerated by the pixel.
 8. An imaging apparatus comprising: asolid-state imaging device including a pixel including a microlens thatcondenses light from a subject, a photoelectric conversion unit thatreceives the subject light condensed by the microlens to generate anelectrical signal according to an amount of received light, and a lightshielding portion provided between the photoelectric conversion unit andthe microlens, wherein the light shielding portion includes an edgeportion formed across over a light receiving surface of thephotoelectric conversion unit, and the edge portion includes a steppedportion on a midway of the edge portion; and a focus determination unitthat performs focus determination through phase difference detectionbased on the signal generated by the pixel.
 9. An imaging apparatuscomprising: a solid-state imaging device including a pixel including amicrolens that condenses light from a subject, a photoelectricconversion unit that receives the subject light condensed by themicrolens to generate an electrical signal according to an amount ofreceived light, and a light shielding portion provided between thephotoelectric conversion unit and the microlens, wherein the pixel isformed at a corner section of the solid-state imaging device, the lightshielding portion includes an edge portion formed across over a lightreceiving surface of the photoelectric conversion unit, and the edgeportion is formed across over the light receiving surface of thephotoelectric conversion unit in a third direction different from both afirst direction corresponding to an up and down direction of an outputimage and a second direction corresponding to a left and right directionof the output image; and a focus determination unit that performs focusdetermination through phase difference detection based on the signalgenerated by the pixel.
 10. A manufacturing method of a solid-stateimaging device, the manufacturing method comprising: a step of forming apixel, the pixel including a microlens that condenses light from asubject, a photoelectric conversion unit that receives the subject lightcondensed by the microlens to generate an electrical signal according toan amount of received light, and a light shielding portion providedbetween the photoelectric conversion unit and the microlens, wherein thelight shielding portion includes an edge portion formed across over alight receiving surface of the photoelectric conversion unit, and theedge portion includes a first edge portion and a second edge portion atpositions different from each other both in a first directioncorresponding to an up and down direction of an output image and asecond direction corresponding to a left and right direction of theoutput image.
 11. A manufacturing method of a solid-state imagingdevice, the manufacturing method comprising: a step of forming a pixel,the pixel including a microlens that condenses light from a subject, aphotoelectric conversion unit that receives the subject light condensedby the microlens to generate an electrical signal according to an amountof received light, and a light shielding portion provided between thephotoelectric conversion unit and the microlens, wherein the lightshielding portion includes an edge portion formed across over a lightreceiving surface of the photoelectric conversion unit, and the edgeportion includes a stepped portion on a midway of the edge portion. 12.A manufacturing method of a solid-state imaging device, themanufacturing method comprising: a step of forming a pixel, the pixelincluding a microlens that condenses light from a subject, aphotoelectric conversion unit that receives the subject light condensedby the microlens to generate an electrical signal according to an amountof received light, and a light shielding portion provided between thephotoelectric conversion unit and the microlens, wherein the pixel isformed at a corner section of the solid-state imaging device, the lightshielding portion includes an edge portion formed across over a lightreceiving surface of the photoelectric conversion unit, and the edgeportion is formed across over the light receiving surface of thephotoelectric conversion unit in a third direction different from both afirst direction corresponding to an up and down direction of an outputimage and a second direction corresponding to a left and right directionof the output image.